Low Viscosity, Thermally Conductive Underfill Epoxy
Well suited for underfill applications, Master
Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at
elevated temperatures. It offers thermal conductivity, electrical insulation
and dimensional stability.
Master Bond EP3UF-1 is a new single component epoxy that is not premixed and
frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable
thixotropic compound is ideal for underfill and many bonding applications.
EP3UF-1 delivers high bond strength and dimensional stability with a
...
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Master Bond EP3UF-1 is a new single component epoxy that is not premixed and
frozen. Due to its low viscosity of 5,000-15,000 cps, this heat curable
thixotropic compound is ideal for underfill and many bonding applications.
EP3UF-1 delivers high bond strength and dimensional stability with a
compressive strength of 18,000-20,000 psi and a tensile modulus of
450,000-500,000 psi.
EP3UF-1 has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F
[1.30-1.44 W/(m•K)], making it an effective thermal interface material. It
contains a special filler with a small particle size. This allows it to be
applied in bond lines as thin as 10-15 microns imparting a low thermal
resistance of 5-7 x 10-6 K•m2/W. It offers superior
electrical insulation with a low dielectric constant of 4.5 at 60 Hz as well as
a high dielectric strength of 450 volts/mil (for 1/8” thick test specimen),
both measured at 75°F.
As a single component system, EP3UF-1 is more convenient to handle, apply
and store than typical two component adhesive systems. It has an unlimited
working life at room temperature and cures in 20-30 minutes at 250°F, or in
10-15 minutes at 300°F. EP3UF-1 is available for use in 10 cc syringes and 30
cc syringes, which are compatible with automated dispensing systems.
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Published by Master Bond on Jan 14, 2019
Master Bond
www.masterbond.com
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T: (201) 343-8983
F: (201) 343-2132
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07601
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