This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.
Toughened Epoxy for Specialty Dam-and-Fill Encapsulation: Supreme 3HTND-2DM
Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. The epoxy passes ASTM E595 specifications for NASA low outgassing enabling it to be used in vacuum, aerospace, electro-optic and other related applications.