Using the Dam & Fill Method to Protect Electronic Components

Adhesives for Electric Vehicles and Automotive Sensors
The rise of electric vehicles and driver aids along with the proliferation of electronic sensors and safety features point towards continued growth in automotive electronics. Due to their lightweight, functional properties, adhesives, encapsulants and coatings will be of increased importance for use in structural bonding, as well as in non-structural applications for electronic, optical and mechanical components in electric vehicle manufacturing. Read more about the properties, uses and future developments of these compounds as they pertain to the automotive industry.

Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

Aerospace Adhesives
From prototype to assembly line, our materials have aided in the success of many companies across the aerospace industry. This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. Our conformal coatings and potting/encapsulation compounds protect sensitive electronic parts against extreme conditions. Many of them meet rigorous industrial certifications including NASA low outgassing requirements.

Potting Compounds Protect Electronic Circuits
Potting Compounds Offer Superior Protection for Electronic Circuits Potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural support and imparting the highest protection from external conditions. There are a variety of potting formulations on the market today that suit the needs of diverse applications. However, a balance must be developed when deciding on the best material. Factors such as handling and processing, open time, viscosity and cure schedules must be considered when determining which formulation to go with. Learn more about the performance properties of epoxies, silicones, UV curables, and B-staged epoxies, plus the packaging options available, to see which is best for the manufacturing and assembly of your electronic device. Shortened version: Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. There are a variety of potting formulations on the market today that suit the needs of diverse applications. Learn about the performance properties of each, plus the packaging options available, to see which is best suited for the manufacturing and assembly of your electronic device.

Importance of CTE of Adhesives for Assembly
Forming reliable bonds between different materials can be challenging because there can be large variations in CTE's (coefficients of thermal expansion). Adhesive compounds play a critical role in the fabrication of assemblies for electronic, optical and mechanical systems. Learn more about typical CTE's for various chemistries such as epoxies and silicones, how fillers can be used to modify CTE, why CTE is dependent on temperature and much more. Specific case studies illustrate the thermal compounds used.

Electrically Conductive Adhesives Make the Right Connections
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Epoxy Compounds Get Even Tougher
With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

Specialized Adhesives Withstand Thermal Cycling
Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications. Learn more about their functional benefits and what to consider when choosing an adhesive for use in thermal cycling applications.

Adhesives for Cryogenic Applications: Case Studies
Specially formulated epoxy systems are capable of maintaining performance at temperatures approaching absolute zero, while delivering the required physical, thermal, and electrical characteristics needed for a specific application. Delve into some select case studies to see how specific cryogenic epoxies are used in a variety of high-tech industries and applications.

Adhesives for Cryogenic Applications: Cryogenic Temperatures and the Role of Specialty Adhesives
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Dual-Curing Adhesives
For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C. This dual cure process benefits a wide variety of bonding, coating, sealing and small encapsulation applications. Learn more about the advantages of dual cure adhesives and how they may enhance the performance properties required in your application.

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimens...

One Part Epoxy Changes from Red to Clear Under UV Light
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material. ...

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications...

Electrically Insulative Two Component Epoxy Features High Elongation
Master Bond epoxy EP21LVFL combines good flexibility with a solid strength profile.

Flexible, Thixotropic, One Component Dual Cure Epoxy
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms

Toughened, One Component Epoxy Features High Glass Transition Temperature
Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste with no flow upon curing.

One Part RTV Silicone Passes Non-Cytotoxicity Standards
Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which needs no mixing, and can be used for bonding, sealing, coating and form-in-place gaske...

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various ...

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing,...

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond introduces EP5TC-80, a one part, NASA low outgassing rated epoxy

Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a fast curing, non-drip compound that is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume.

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature
Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.

Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. 

High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications
heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days

UV Curing Adhesive Passes NASA Low Outgassing Specifications
Master Bond UV Curable Adhesives

Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting.

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism.