Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Adhesives for the Medical Industry
For an overview of Master Bond’s most popular medical grade epoxies, please browse this easy to read catalog organized by chemistry, key properties and curing schedules. From the prototype stage through the manufacturing process, each compound in this 20 page catalog is designed to meet specific application requirements. Applications range from diagnostic equipment to disposable and reusable devices, from medical electronics to orthopedic and prosthetic devices, and more. All products listed are USP Class VI approved and select items are ISO 10993-5 Cytotoxicity Certified.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Polymeric Systems Bring Clarity to Optical Applications
Whereas some optical assembly applications require optical clarity across a certain wavelenth, others require an opaque coating. Optical grade epoxies, silicones and UV curable coatings provide the versatility to adhere well to a wide variety of substrates and the critical performance properties necessary. Learn more about optical transmission, refractive indices, temperature and humidity testing, and more, and the roles these measurements in choosing an effective and reliable optical polymer system.

Conformal Coatings for Reliable Electronic Assemblies
Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting the areas they cover while strengthening delicate components and traces. Find out more about how conformal coatings enhance the reliability and longevity of electronic printed circuit boards.

Electrically Conductive Adhesives Make The Right Connections
With the growing complexity of electronic circuits, engineers are looking toward electrically conductive adhesives to package and assemble them. These systems deliver durable bonds with conductive paths for a variety of challenging applications in the electronics industry. They can be formulated to include excellent physical strength, electrical conductivity, toughness, high temperature resistance and many other properties.

Silicones Meet the Needs of the Electronics Industry
Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting and encapsulation compounds are used in hundreds of consumer, business, medical, and military electronic systems. In this white paper, learn what makes silicones different from other organic polymers, why their properties remain stable across different temperatures, and how they have played a major role in the rapid innovation of the electronics industry.

UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”....

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. 

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. 

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1.

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Master Bond EP3HTSDA-2 is a fast curing, one part silverfilled system offering exceptionally high thermal andelectrical conductivity, along with remarkably low thermalresistance.

Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient o...

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils.

Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure.

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.

Product Spotlight: EP62-1

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.

Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubber and plastics. The system has...

No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C
One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher.