Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Epoxy Compounds Get Even Tougher
With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s white paper examines the use of these toughened epoxies.

Specialized Adhesives Withstand Thermal Cycling
Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications. Learn more about their functional benefits and what to consider when choosing an adhesive for use in thermal cycling applications.

Aerospace Adhesives
From prototype to assembly line, our materials have aided in the success of many companies across the aerospace industry. This 28 page catalog features a variety of products that are widely used for structural bonding, sealing and gap filling. These formulations ensure reliability in the assembly of aircraft structures, components, interiors and MRO applications. Our conformal coatings and potting/encapsulation compounds protect sensitive electronic parts against extreme conditions. Many of them meet rigorous industrial certifications including NASA low outgassing requirements.

Adhesives for Cryogenic Applications: Case Studies
Specially formulated epoxy systems are capable of maintaining performance at temperatures approaching absolute zero, while delivering the required physical, thermal, and electrical characteristics needed for a specific application. Delve into some select case studies to see how specific cryogenic epoxies are used in a variety of high-tech industries and applications.

Adhesives for Cryogenic Applications: Cryogenic Temperatures and the Role of Specialty Adhesives
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond introduces EP5TC-80, a one part, NASA low outgassing rated epoxy

Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a fast curing, non-drip compound that is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume.

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature
Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.

Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. 

High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications
heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days

UV Curing Adhesive Passes NASA Low Outgassing Specifications
Master Bond UV Curable Adhesives

Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting.

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.

Silver Conductive, One Component Epoxy Cures at 80°C
One component, toughened, silver conductive epoxy system

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Flame retardant non-halogenated system is thermally conductive and a reliable electrical insulator.

Biocompatible, Nanosilica Filled LED Curable Adhesive
Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source.

Low Viscosity, Thermally Conductive Underfill Epoxy
Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. 

UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”....

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. 

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. 

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1.

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Master Bond EP3HTSDA-2 is a fast curing, one part silverfilled system offering exceptionally high thermal andelectrical conductivity, along with remarkably low thermalresistance.

Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient o...