eBook: Adhesives for Sensor Applications

eBook: Adhesives for Sensor Applications
Sensors are expected to deliver accurate data reliably despite exposure to harsh environments including continued stress from thermal, chemical or mechanical factors. Epoxy compounds serve a critical role in these applications – helping to ensure optimal performance throughout the life of these devices. Read through these real-life case studies based on materials published in peer reviewed scientific journals and patents to learn more about adhesive formulations that may benefit your sensor device application.

Use of Adhesives and Sealants for Hermetic Wire Feedthroughs
The hermetic sealing of electrical and optical feedthroughs is a critical area for assuring the longevity and reliability of devices such as optical assemblies, thermocouples, EV battery packs, power supplies, transformers, and generators. Epoxy adhesive sealing or potting offers exceptional processing flexibility, especially for hermetically sealing wire feedthroughs composed of many conductors through a small diameter housing. Epoxy polymer is inherently electrically insulative and exhibits high adhesion to materials including metals, ceramics, glass, and some plastics, providing a greater range of adhesion compared with glass and ceramic sealing. The epoxy fabrication and curing process allows for a wide array of different conductors to be hermetically sealed within a housing. Download this white paper to learn more about this process and the adhesive requirements for hermetic wire feedthroughs, EV battery pack applications, and a case study from NASA.

Adhesives for Cryogenic Applications: Case Studies
Specially formulated epoxy systems are capable of maintaining performance at temperatures approaching absolute zero, while delivering the required physical, thermal, and electrical characteristics needed for a specific application. Delve into some select case studies to see how specific cryogenic epoxies are used in a variety of high tech industries and applications.

High Tg Adhesive Systems
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

EP40 Structural Epoxy Used for Steel Bonding in Marine Applications
Master Bond EP40 is a two-part, room-temperature-curing epoxy for bonding, sealing, coating, and encapsulating. This low-to-moderate viscosity system has a forgiving 1-to-1 mix ratio by weight or volume and can be cured at ambient temperatures or more rapidly at higher temperatures. EP40 bonds well to a variety of substrates, including naval steel, the primary structural metal used in the shipbuilding industry.

One -Component Epoxies Offer Versatility and Ease of Use
To understand one part epoxy systems, you need to know how a two part system works. In this white paper, we explore how a one part system is constructed, how it can and should be used, and how it can be modified to achieve a variety of performance properties. Also learn how technological advances have resulted in innovative, unique systems.

Supreme 10HT: Utilized in structural bonding for supersonic aircraft, electronics packaging and capacitor tanks
Because of its outstanding strength and other physical properties, Master Bond Supreme 10HT has been selected for use in several published research studies. Following are summaries of how Supreme 10HT performed in demanding applications outlined in these studies.

Biocompatible Epoxies for Medical Device Manufacturing
This article discusses the use of biocompatible, two-part epoxies in medical devices. When used as adhesive encapsulants these products improve the ruggedness of wire-bonded, chip-on-board microelectronic assemblies. Biocompatible products from Master Bond include EP42HT-2Med and the enhanced EP42HT-4AOMed Black product.

Dual Seal Method for the Hermetic Sealing of Microbatteries
An adhesive for hermetically sealing batteries must resist chemicals, temperature, pressure, and electricity while ensuring minimal outgassing, low moisture permeability, high adhesion to packaging materials, and compatibility with the battery's electrolyte. Its rheological properties must support a continuous, impermeable seal and maintain integrity across temperature variations, with a thermal expansion coefficient aligned with the battery casing. Learn more about adhesive requirements and challenges for microbattery sealing in this white paper.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Adhesives for Cryogenic Applications: Cryogenic Temperatures and the Role of Specialty Adhesives
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.

Adhesives for the Medical Industry
For an overview of our most popular medical grade epoxies, browse this easy to read catalog organized by chemistry, key properties and curing schedules.

Optically Clear, High Flexibility Silicone Meets NASA Low Outgassing Specifications
Master Bond MasterSil 981-LO is a two component, addition cured silicone system designed for bonding, sealing, coating, and encapsulating applications. It meets NASA low outgassing specifications and features optical clarity, particularly in thin secti...

NASA Low Outgassing, Chemically Resistant Epoxy Features High Tg
Master Bond EP64 is a two-component, vacuum-compatible epoxy system engineered for bonding, sealing, and coating applications. It features a high glass transition temperature (Tg) of 210–215°C and meets NASA low outgassing specifications per ASTM E595 ...

Non-Frozen, Silver Filled Epoxy Features High Thermal and Electrical Conductivity
Master Bond EP6STC-80 is a one component, non-frozen, silver filled epoxy engineered for bonding, sealing, and coating applications requiring exceptional thermal and electrical conductivity. This system offers an unlimited working life at room temperat...

Dual Cure Medical Adhesive Features High Tg and Autoclave Resistance
Master Bond UV26DCMed is a one component, dual cure adhesive system designed for medical device assembly. It is specifically engineered for reusable devices that require repeated sterilization, including steam autoclaving, ethylene oxide, and glutarald...

Electrically Insulating Epoxy Features Ultra-High Thermal Conductivity
Master Bond EP54TC is a two-component epoxy engineered for heat sink bonding and thermal management applications where efficient heat transfer is critical. Featuring the highest thermal conductivity in the Master Bond electrically insulating portfolio—...

One Part 300°C Rated Silicone Passes Non-Cytotoxicity Standards
MasterSil 800Med is a one component, moisture curing silicone specifically designed for medical device manufacturing. It passes ISO 10993-5 testing for non-cytotoxicity, confirming its suitability for use in medical device applications.

Nanosilica Filled, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates

One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver...

Toughened, UV Curable Adhesive Features Optical Clarity
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a UV...

Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of appr...

Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
One component, dual curing LED/heat system that allows for rapid LED initiated fixturing followed by full cure by adding heat; meets ISO 10993-5

Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications
Master Bond launches EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperatu...

Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme 121AOND not only provides excellent chemical resistance, but also offe...

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies will yellow over time, especially upon exposure to heat and intense UV ...

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electro...

Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process
Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low Temperature Sterilization System. This study was recently published in a peer...

Non-Drip Epoxy Features Acid Resistance
Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% p...

Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications
Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since it has a relatively long working life of 60-90 minutes (at room temperat...

One Component, Dual Cure Epoxy for Medical Applications
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn'...

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is a...

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimens...

One Part Epoxy Changes from Red to Clear Under UV Light
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material. ...

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications...

Electrically Insulative Two Component Epoxy Features High Elongation
Master Bond epoxy EP21LVFL combines good flexibility with a solid strength profile.

Flexible, Thixotropic, One Component Dual Cure Epoxy
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms

Toughened, One Component Epoxy Features High Glass Transition Temperature
Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste with no flow upon curing.

One Part RTV Silicone Passes Non-Cytotoxicity Standards
Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which needs no mixing, and can be used for bonding, sealing, coating and form-in-place gaske...

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various ...

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing,...

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond introduces EP5TC-80, a one part, NASA low outgassing rated epoxy