New Video Showcases Online Build-A-Part™
Product Configurator Tool
Advanced Interconnections Corp. (AIC), a leading designer and manufacturer of interconnect solutions for the global electronics industry, recently published a new video highlighting how to quickly build an application-specific connector part number with its Build-A-Part™ tool. The video offers a quick tutorial for using the online product configurator’s easy-to-use parametric search menus to build an IC Socket, Adapter, or Board-to-Board Connector part number. As each option is selected from a drop-down menu, such as number of positions, insulator style, and terminal type, the connector part number appears on the screen along with helpful product images.
In just a few minutes, the video shows how a design engineer or buyer can print a part-specific spec sheet, quickly access a CAD drawing, check stock, or request a quote or sample using the handy, online Build-A-Part tool. The new Build-A-Part video is available on the Advanced Interconnections’ website at https://www.advanced.com/bap.
Advanced Interconnections Corporation designs and manufactures electronic interconnect solutions, specializing in customized PCB connector and IC socketing systems for high reliability applications. 2017 marks 35 years of proudly manufacturing in the USA. For more information, contact the company at email@example.com or visit www.advanced.com. Headquarters: 5 Energy Way, West Warwick, RI 02893 USA. Tel: (401) 823-5200.
For more information send an inquiry directly to Advanced Interconnections Corporation
Application Note: Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production.This, along with other challenges associated with QFP packages such as non-coplanar leads “lifting”after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly. A robust alternative has been developed for using BGA devices on boards designed with QFP pads. This proprietary technology employs the advantages of the BGA package directly on the board interface –eliminating the design weaknesses and processing challenges associated with gull-wing leads, while allowing uninterrupted production using existing board inventory.