Since 1982, Advanced Interconnections has been recognized as a leading designer and manufacturer of innovative, technologically advanced interconnect solutions. From our earliest invention of the world's first removable terminal carrier, Peel-A-Way®, to our rugged, high dens...
Since 1982, Advanced Interconnections has been
recognized as a leading designer and manufacturer of innovative,
technologically advanced interconnect solutions. From our earliest invention of
first removable terminal carrier, Peel-A-Way®, to our rugged, high density B2B®
SMT Connectors, our designs are used in electronic applications around the
world including telecommunications, military, automotive development, high-end
computer servers, medical equipment, and more.
Advanced Interconnections Corp. designs and manufactures customized interconnect solutions for semiconductor development and high reliability electronic applications. Our IC sockets, package conversion adapters, and board to board connectors feature screw-machined terminals for field-proven performance and durability.
From prototype to production volumes, innovative surface mount and thru-hole designs are produced to customer-specific requirements in our vertically integrated manufacturing facility in the USA, and shipped worldwide through our global network of authorized distributors.
For more information contact Advanced Interconnections Corporation
Application Note: Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production.This, along with other challenges associated with QFP packages such as non-coplanar leads “lifting”after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly. A robust alternative has been developed for using BGA devices on boards designed with QFP pads. This proprietary technology employs the advantages of the BGA package directly on the board interface –eliminating the design weaknesses and processing challenges associated with gull-wing leads, while allowing uninterrupted production using existing board inventory.
Advanced Interconnections Completes Transition to New ISO 9001:2015 Standard
Advanced Interconnections Corp. (AIC), a leading manufacturer of PC board connectors and semiconductor sockets, is pleased to announce the successful recertification of its quality management system to the newest ISO 9001 Standard. ISO 9001:2...Jan 09, 2018
Advanced Interconnections Corporation
5 Energy Way
West Warwick, RI