Flip Chip Assemblies with Underfill Encapsulants

EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature and pressure of space.

Electrically Conductive Adhesives Make the Right Connections
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

How To Relieve Thermally Induced Stress With Epoxies
Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.

Flame Retardant Epoxies and Silicones Meet Critical Safety Requirements
Designed to mitigate the worst effects of fires, fire retardant materials play a particularly important role in aircraft construction. Used in aircraft, epoxies and silicones must maintain their primary role as adhesives or coatings while exhibiting resistance to heat and flame in accordance with government and industry specifications.

Die Attach Adhesives Impact Product Quality Well Beyond Manufacturing
Die attach adhesives serve a vital role in semi-conductor assembly, manufacturing and throughout the product life cycle. In this white paper, learn how they facilitate assembly and about the application process. Read why thin bond lines are so important for product life cycle. Bond strength is only one, albeit critical requirement for many applications; read about many other performance characteristics of epoxies and why they offer diverse solutions to meet critical application needs.

Adhesives, Sealants & Coatings for the Optical Industry
Browse this catalog on our line of epoxy, silicone and light curing compounds that meet the specific demands of the optical industry. This 24 page catalog features performance properties on Master Bond’s extensive line of epoxy, silicone and light curing compounds that meet the specific demands of the optical, fiber-optic, electro-optic, display, photonic and biophotonic industries.

Flip Chip Assemblies with Underfill Encapsulants
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.

Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a fast curing, non-drip compound that is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume.

Electrically Conductive Die Attach Epoxy with High Glass Transition Temperature
Master Bond EP17HTS-DA is a new one component, no mix, die attach epoxy that is electrically conductive and withstands high temperatures.

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation
Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively utilized for underfill and encapsulation applications.

Thermally Conductive, Electrically Insulative Potting Compound Resists High Temperatures
Master Bond Supreme 121AO is a NASA low outgassing approved epoxy suitable for bonding, sealing and potting applications. 

High Tg, Ultra Low Viscosity Epoxy meets NASA Low Outgassing Specifications
heat curable system with a very low viscosity of 50-200 cps and a long open time of 2-3 days

UV Curing Adhesive Passes NASA Low Outgassing Specifications
Master Bond UV Curable Adhesives

Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting.

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.

Silver Conductive, One Component Epoxy Cures at 80°C
One component, toughened, silver conductive epoxy system

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Flame retardant non-halogenated system is thermally conductive and a reliable electrical insulator.

Biocompatible, Nanosilica Filled LED Curable Adhesive
Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source.

Low Viscosity, Thermally Conductive Underfill Epoxy
Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. 

UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”....

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. 

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. 

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1.

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Master Bond EP3HTSDA-2 is a fast curing, one part silverfilled system offering exceptionally high thermal andelectrical conductivity, along with remarkably low thermalresistance.

Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient o...

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils.

Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure.

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.

Product Spotlight: EP62-1

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.