Flip Chip Assemblies with Underfill Encapsulants

Adhesives, Sealants & Coatings for the Optical Industry
Browse this catalog on our line of epoxy, silicone and light curing compounds that meet the specific demands of the optical industry. This 24 page catalog features performance properties on Master Bond’s extensive line of epoxy, silicone and light curing compounds that meet the specific demands of the optical, fiber-optic, electro-optic, display, photonic and biophotonic industries.

Flip Chip Assemblies with Underfill Encapsulants
The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable properties. In this white paper, we explore what properties are required for effective underfills to ensure reliability and quality in flip chip applications.

Importance of CTE of Adhesives for Assembly Reliability
Forming reliable bonds between different materials can be challenging because there can be large variations in CTE's (coefficients of thermal expansion). Adhesive compounds play a critical role in the fabrication of assemblies for electronic, optical and mechanical systems. Learn more about typical CTE's for various chemistries such as epoxies and silicones, how fillers can be used to modify CTE, why CTE is dependent on temperature and much more. Specific case studies illustrate the thermal compounds used. Teaser: Is there a solution to the thermal expansion mismatch of components for an electronic assembly? You bet, and one solution is to use a specialized adhesive that can withstand thermal expansion effects.

Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

One -Component Epoxies Offer Versatility and Ease of Use
To understand one part epoxy systems, you need to know how a two part system works. In this white paper, we explore how a one part system is constructed, how it can and should be used, and how it can be modified to achieve a variety of performance properties. Also learn how technological advances have resulted in innovative, unique systems.

Epoxy Compounds Get Even Tougher
With adhesive products, high performance and rigidity are often thought to go hand in hand. It is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is a growing class of adhesives, sealants and coatings that add ductility to the long list of desirable epoxy properties. Master Bond’s whitepaper examines the use of these toughened epoxies.

Toughened Epoxy Polysulfide Hybrid Offers Advanced Chemical Resistance
Master Bond EP21TP-2NV is a two part epoxy polysulfide formulated for use as an adhesive, sealant and potting system.

Non-Premixed and Frozen, One Part Epoxy for Chip Coating

Optically Clear, Low Viscosity Epoxy System Features High Flexibility
Two part epoxy, Master Bond EP88FL, is a low viscosity, optically clear system featuring good flexibility for high performance bonding, coating, sealing and potting.

Dual Curing Epoxy Meets Biocompatibility and Cytotoxicity Requirements
Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Graphene Filled Epoxy Offers 5.5 W/(m•K) Thermal Conductivity
Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity.

Silver Conductive, One Component Epoxy Cures at 80°C
One component, toughened, silver conductive epoxy system

Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test
Flame retardant non-halogenated system is thermally conductive and a reliable electrical insulator.

Biocompatible, Nanosilica Filled LED Curable Adhesive
Master Bond LED405Med is a one part, nanofilled system that cures quickly upon exposure to a 405 nm LED light. It does not require a UV light source.

Low Viscosity, Thermally Conductive Underfill Epoxy
Well suited for underfill applications, Master Bond EP3UF-1 is a one part, low viscosity epoxy adhesive that cures rapidly at elevated temperatures. It offers thermal conductivity, electrical insulation and dimensional stability. 

UL 1203 Certified Epoxy for Explosion-Proof & Dust-Ignition-Proof Electrical Equipment
Master Bond EP41S-6 is a new two component epoxy system that meets UL 1203, which is defined by Underwriters Laboratories as the “Standard for Explosion-Proof and Dust-Ignition-Proof Electrical Equipment for Use in Hazardous (Classified) Locations”....

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial
Master Bond EP70CN is a two part, thermally stable epoxy adhesive formulated using a natural, renewable and sustainable ingredient. 

Two Part Epoxy Adhesive for Structural Bonding Features Long Pot Life

Epoxy Features Very Low Coefficient of Thermal Expansion
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. 

Toughened Two Part Epoxy Withstands Repeated Thermal Cycling
Master Bond Inc. has developed a solvent free, two component, toughened epoxy system called Supreme 62-1.

One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability
Master Bond EP3HTSDA-2 is a fast curing, one part silverfilled system offering exceptionally high thermal andelectrical conductivity, along with remarkably low thermalresistance.

Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy.

Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion
Master Bond EP42HT-3AO is thermally conductive, electrically insulating epoxy for bonding, sealing, coating and encapsulation applications. Among its many favorable attributes, this system has a high glass transition temperature and a low coefficient o...

Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile
Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. 

Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F
Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils.

Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance

Toughened, Two Component Epoxy Features Enhanced Dimensional Stability and a Long Working Life
Developed for potting, sealing, encapsulation and casting applications, Master Bond EP110F8-5 is dimensionally stable and has low shrinkage upon cure.

One Component, High Temperature Resistant Epoxy Offers a Low Coefficient of Thermal Expansion
Featuring a low coefficient of thermal expansion (CTE) of 15-20 x 10-6 in/in/°C, Master Bond EP13LTE is a one part epoxy for structural bonding applications.

Product Spotlight: EP62-1

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.

Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubber and plastics. The system has...

No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C
One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher.