Mentor Graphics Corporation Company Profile
Mentor Graphics® is a leader in electronic design automation software. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of...
Mentor Graphics® is a leader in electronic design automation software. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design.
Mentor’s CFD software provides fast, accurate, and design-centric 1D and 3D thermal simulation to mechanical and electrical engineers working in automotive, electronics, aerospace, and process engineering. With Mentor CFD, fluid flow and heat-transfer simulation can be frontloaded into your CAD and EDA software of choice so that you can optimize a thermal solution early in the design process. To find out more about how CFD can be used to accelerate your design cycle, visit us at www.m...
Accurate Thermo-Fluid Simulation in Real Time Environments
The crux of any task undertaken in System Level Thermo-Fluid Analysis is striking a balance between time and accuracy. This paper describes the "Design of Experiments" approach used to address the issue of providing accurate simulation results in real-time. It will cover: Meta-models & the design of experiments approach How to Construct and fit a meta-model Generating inputs for the meta-model Evaluating and assessing the meta-model
What is System Level Thermo-Fluid Analysis?
This paper will explain some of the fundamentals of System Level Thermo-Fluid Analysis and demonstrate why 1D CFD is not an accurate description. It will shed some light on both the philosophy that underpins the system approach and how and why it is used. It will cover: Building Blocks of System Level Analysis Thermo & Fluid Dynamics Pressure Drop: Paying your Dues Understanding The Fourth Dimension
The 10 Myths of Computational Fluid Dynamics
Some five years ago we felt compelled to write our whitepaper The Five Myths of Computational Fluid Dynamics. Since then, we have had a lot of feedback regarding our views, and broadly, our debunking of these myths resonated with people. Through all the feedback and conversations weve had on this topic, its become clear that the situation is more complex than we first thought. Here, we provide a summary of the original myths, introduce four new related myths, and add a completely new one.
11 Top Tips for Energy-Efficient Data Center Design and Operation A High-Level How To Guide
The usage of data centers globally has skyrocketed over recent years in response to growing demand for information storage and transfer. Data center power load (and therefore heat dissipation) footprints continue to rise, with greenhouse gas emissions from data centers expected to overtake airline industry emissions by 2020. Cooling constitutes a major cost in the operation of a data center which has led to increased focus on minimizing energy use in data centers.
12 Key Considerations in Enclosure Thermal Design A High-Level How To Guide
A natural focus when designing electronics products are, well the electronics. The electronics itself however, needs to work within some kind of enclosure, and the electronics have to be designed with the enclosure in mind. The enclosure can act as either a barrier or a conduit for carrying the heat away to the ambient, or possibly both. Cooling is a system issue, which is why we advocate a top-down approach, starting at the enclosure level.
10 Tips for Streamlining PCB Thermal Design A High-Level How To Guide
Many aspects of a PCBs performance are determined during detailed design, e.g. making a trace a specific length for timing reasons. Timing issues are also affected by temperature differences between components. Thermal issues with the PCB design are largely locked in during the component (i.e. chip package) selection and layout phases. After this point only remedial actions are possible if components are found to run too hot.
10 Tips for Predicting Component Temperatures A High-Level How To Guide
More recently, physics-based reliability prediction has related electronic assembly failure rates to the rate and magnitude of temperature change over an operational cycle, both of which are influenced by steady-state operating temperature. Whether the intention is to increase reliability, improve performance, or avoid problems during operation, accurate prediction of component temperatures helps meet design goals.
Mentor Graphics Corporation
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