Two Component, Low Viscosity, Cryogenically Serviceable Epoxy System EP29LPSP

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. EP29LPSP is serviceable at temperatures as low as 4K as an adhesive, sealant and protective coating, but more importantly, it is able to withstand cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).


 
 

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