How To Relieve Thermally Induced Stress With Epoxies

Supreme 10HT: Utilized in structural bonding for supersonic aircraft, electronics packaging and capacitor tanks
Because of its outstanding strength and other physical properties, Master Bond Supreme 10HT has been selected for use in several published research studies. Following are summaries of how Supreme 10HT performed in demanding applications outlined in these studies.

Biocompatible Epoxies for Medical Device Manufacturing
This article discusses the use of biocompatible, two-part epoxies in medical devices. When used as adhesive encapsulants these products improve the ruggedness of wire-bonded, chip-on-board microelectronic assemblies. Biocompatible products from Master Bond include EP42HT-2Med and the enhanced EP42HT-4AOMed Black product.

Dual Seal Method for the Hermetic Sealing of Microbatteries
An adhesive for hermetically sealing batteries must resist chemicals, temperature, pressure, and electricity while ensuring minimal outgassing, low moisture permeability, high adhesion to packaging materials, and compatibility with the battery's electrolyte. Its rheological properties must support a continuous, impermeable seal and maintain integrity across temperature variations, with a thermal expansion coefficient aligned with the battery casing. Learn more about adhesive requirements and challenges for microbattery sealing in this white paper.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Adhesives for Cryogenic Applications: Cryogenic Temperatures and the Role of Specialty Adhesives
What are the challenges facing applications that operate at cryogenic temperatures? What effect do these low temperatures have on efforts to bond, seal, coat or encapsulate these applications? In this paper, learn how specialized adhesives meet the performance requirements necessary to maintain the physical, thermal and electrical properties as temperatures approaching absolute zero.

Adhesives for the Medical Industry
For an overview of our most popular medical grade epoxies, browse this easy to read catalog organized by chemistry, key properties and curing schedules.

Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

Importance of CTE of Adhesives for Assembly
Forming reliable bonds between different materials can be challenging because there can be large variations in CTE's (coefficients of thermal expansion). Adhesive compounds play a critical role in the fabrication of assemblies for electronic, optical and mechanical systems. Learn more about typical CTE's for various chemistries such as epoxies and silicones, how fillers can be used to modify CTE, why CTE is dependent on temperature and much more. Specific case studies illustrate the thermal compounds used.

Electrically Conductive Adhesives Make the Right Connections
As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.

Dual-Curing Adhesives
For a UV curable adhesive, the cure initiates after exposure to UV light at a wavelength that is specific to the photo-initiator used in the formula. A dual cure adhesive has the UV light cure as the first step in the process, followed by a secondary thermal cure achievable at temperatures as low as 80°C. This dual cure process benefits a wide variety of bonding, coating, sealing and small encapsulation applications. Learn more about the advantages of dual cure adhesives and how they may enhance the performance properties required in your application.

EP21TDCS-LO: A Conductive Bonding Agent for Space-Environment Assemblies
Conductive bonding agents play a fundamental role in ensuring reliable electrical connectivity in many electromechanical assemblies designed to operate at the extremes of temperature and pressure of space.

How To Relieve Thermally Induced Stress With Epoxies
Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encapsulate components. Design engineers can learn more about finding ways to minimize or relieve stress in this white paper.

One Part Silver Filled Electrically Conductive Epoxy Passes ISO 10993-5 Standard
Master Bond EP3HTSDA-2Med is a true one component epoxy that is not pre-mixed and frozen. It offers an easy dispensing profile with an exceptionally long working life at room temperature, making it ideal for streamlining automated assembly. As a silver...

Toughened, UV Curable Adhesive Features Optical Clarity
Master Bond UV15-7HP is a low viscosity, easy to apply, one-part, UV curable adhesive system. Optimal adhesion is achieved in bond line thicknesses of 0.001-0.003 inch, and it can cure rapidly with a minimum intensity of 20-40 milliwatts/cm2 using a UV...

Non-Drip Cryogenic Epoxy Offers Electrical and Thermal Insulation
Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and thermally insulative, with a thermal conductivity of appr...

Medical Grade, Dual Curable Adhesive Offers Rapid Fixturing with LED Light
One component, dual curing LED/heat system that allows for rapid LED initiated fixturing followed by full cure by adding heat; meets ISO 10993-5

Thermally Conductive, Flowable Epoxy Meets NASA Low Outgassing Specifications
Master Bond launches EP53TC, a two-component epoxy designed for bonding, sealing, coating, and small potting applications where efficient heat dissipation is crucial. It is a flowable system with a mixed viscosity of 45,000-65,000 cps at room temperatu...

Toughened, Non-Drip Epoxy Features High Glass Transition Temperature
Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. Supreme 121AOND not only provides excellent chemical resistance, but also offe...

Low Viscosity, Optically Clear Epoxy Passes ISO 10993-5 Standard
Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies will yellow over time, especially upon exposure to heat and intense UV ...

One Part, Fast Curing Epoxy Meets NASA Low Outgassing Specifications
Master Bond EP3HT-LO is a single component, non-premixed & frozen, heat cured epoxy, with an unlimited working life at room temperature. This system passes ASTM E595 tests for NASA low outgassing, making it well suited for use in the aerospace, electro...

Master Bond’s Epoxy Compatibility with STERIS’s Vaporized Hydrogen Peroxide Sterilization Process
Master Bond and STERIS collaborated in research to determine the compatibility of Master Bond’s specialty epoxies with Vaporized Hydrogen Peroxide (VHPTM) using V-PRO® s2 Low Temperature Sterilization System. This study was recently published in a peer...

Non-Drip Epoxy Features Acid Resistance
Master Bond EP21ARHTND-2 is a two part epoxy adhesive, designed to withstand prolonged exposure to a wide range of chemicals. “The system’s chemical resistance was successfully tested in chemicals such as 98% sulfuric acid, 25% hydrochloric acid, 20% p...

Thermally Conductive Structural Epoxy Meets NASA Low Outgassing Specifications
Master Bond Supreme 11AOHTLP is a two component epoxy featuring thermal conductivity and electrical insulation. This system is specifically designed for bonding larger parts since it has a relatively long working life of 60-90 minutes (at room temperat...

One Component, Dual Cure Epoxy for Medical Applications
Master Bond UV15DC80-1Med offers a unique dual cure mechanism utilizing UV light for initial fixation followed by heat for complete polymerization. This addresses limitations of traditional UV adhesives by effectively curing shadowed areas that wouldn'...

Two Part, Silver Filled Silicone Adhesive Meets NASA Low Outgassing Specifications
Master Bond MasterSil 323S-LO is an addition cured silicone that is not only electrically conductive, but also thermally conductive. This ASTM E-595 low outgassing rated product is designed for bonding applications where low stress is critical and is a...

Underfill Epoxy Offers High Glass Transition Temperature and Low Viscosity
Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications. This optically clear compound features high dimens...

One Part Epoxy Changes from Red to Clear Under UV Light
Master Bond UV15RCL is a low viscosity, cationic type UV curing system with a special color changing feature. The originally red material changes to clear once exposed to UV light, indicating that there is UV light access across the adhesive material. ...

Two Part Structural Epoxy Meets ISO 10993-5 for Non-Cytotoxicity
Master Bond Supreme 11AOHTMed is a two component epoxy featuring thermal conductivity and electrical insulation. This system fully passes ISO 10993-5 testing for non-cytotoxicity and is recommended for bonding and sealing in medical device applications...

Electrically Insulative Two Component Epoxy Features High Elongation
Master Bond epoxy EP21LVFL combines good flexibility with a solid strength profile.

Flexible, Thixotropic, One Component Dual Cure Epoxy
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms

Toughened, One Component Epoxy Features High Glass Transition Temperature
Master Bond Supreme 17HTND-2 is a one component toughened epoxy for bonding and sealing. It is a paste with no flow upon curing.

One Part RTV Silicone Passes Non-Cytotoxicity Standards
Designed for medical device manufacturing, MasterSil 711Med passes ISO 10993-5 testing. It is a one part, flowable, room temperature vulcanizing (RTV) silicone which needs no mixing, and can be used for bonding, sealing, coating and form-in-place gaske...

Thermally Conductive, Electrically Insulative Epoxy for Medical Device Applications
Master Bond EP40TCMed is a two part, room temperature curing epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity. It is thermally conductive, electrically non-conductive and can be utilized as an adhesive or sealant in various ...

One Part, Toughened Epoxy for Dam-and-Fill Encapsulation
Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing,...

Electrically Isolating Epoxy Features Ultra High Heat Transfer Capability
Master Bond introduces EP5TC-80, a one part, NASA low outgassing rated epoxy

Fast Setting, Two Component Epoxy Color Coded for Proper Mixing
Master Bond EP51CC is a fast curing, non-drip compound that is ideal for bonding and sealing applications with a forgiving mix ratio of one to one by weight or volume.