Application Note: Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability

IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production.This, along with other challenges associated with QFP packages such as non-coplanar leads “lifting”after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly.

A robust alternative has been developed for using BGA devices on boards designed with QFP pads. This proprietary technology employs the advantages of the BGA package directly on the board interface –eliminating the design weaknesses and processing challenges associated with gull-wing leads, while allowing uninterrupted production using existing board inventory.



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www.advanced.com
E: info@advanced.com
     info@advanced.com
T (800) 424-9850
   (401) 823-5200
F: (401) 823-8723

Address
5 Energy Way
West Warwick, RI
02893-2389
United States
View map

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