Using the Dam & Fill Method to Protect Electronic Components

Get an up close look at how the dam and fill process works to protect electronic components on a circuit board. This two step method utilizes a damming compound such as Master Bond Supreme 3HTND-2DM-1 to create a barrier around the component, while the flowable filler material, EP3UF-1, covers the component for protection.


 
 

Master Bond

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T: (201) 343-8983
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Hackensack, NJ
07601
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