Fujipoly® Announces Free Thermal Interface Material Webinar
Live webinar to reveal advantages putty-type thermal interface materials offer compared to standard gap filler pads.
Fujipoly® will host a live webinar that reveals many of the advantages putty-type thermal interface materials offer compared to standard gap filler pads. Thermal interface material expert Christian Mainegra, will also host a live question and answer session immediately follow the 30-minute presentation.
Key topics will include stress strain comparisons of putties and standard gap fillers, advantages of putty over dispensable thermal interface materials, as well as putty handling and application suggestions.
Register for Free at
Published by Fujipoly America Corporation on Feb 06, 2019
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