Epoxy Features Very Low Coefficient of Thermal Expansion

Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. 

 

Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required. EP30LTE-2 is a highly dimensionally stable epoxy ...

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Master Bond EP30LTE-2 can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal expansion (CTE) is required.


EP30LTE-2 is a highly dimensionally stable epoxy system with low linear and volumetric shrinkage upon curing. The compressive strength of the cured material is 24,000-26,000 psi and its CTE is very low at 10-13 x 10-6/in/in/°C. It is a reliable electrical insulator featuring volume resistivity of more than 1015 ohm-cm. EP30LTE-2 meets NASA low outgassing specifications and features a combination of physical properties making it ideal for applications in aerospace, optical, electronic and specialty OEM industries where these requirements are critical.

EP30LTE-2 is a two part epoxy which obtains optimal properties when cured overnight at room temperature followed by a heat cure for 2-4 hours at 150-200°F. This system offers moderate flow characteristics with a mixed viscosity ranging from 70,000 to 100,000 cps. In addition to standard packaging units of ½ pint, pint, quart, gallon and 5 gallon kits, the epoxy is available in premixed and frozen syringes.

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Published by Master Bond on Jun 27, 2018

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Master Bond

www.masterbond.com
E: main@masterbond.com
T: (201) 343-8983
F: (201) 343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
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Master Bond

www.masterbond.com
E: main@masterbond.com
T: (201) 343-8983
F: (201) 343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
View map

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