EO-21M-5, Low Viscosity, Electrically Conductive Adhesive

 

epoxySet presents the EO-21M-5, room temperature curing, electrically conductive epoxy for electrical circuits, die attach and EMI Shielding. This silver filled adhesive offers excellent bonds to most substrates including metals, ceramic, glass and engineered plastics. It is a choice material fo...

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epoxySet presents the EO-21M-5, room temperature curing, electrically conductive epoxy for electrical circuits, die attach and EMI Shielding. This silver filled adhesive offers excellent bonds to most substrates including metals, ceramic, glass and engineered plastics. It is a choice material for solder replacement where a heat cure is not acceptable.

The EO-21M-5 cures to a semi-rigid plastic that can withstand temperature cycling of -55 to 150°C. It has been used to cryogenic temperatures offering low stress thus preventing component fracturing. The low viscosity of 1,500cps allows for easy mixing and dispensing. With a 3 to 4 hour work time and easy 10:1 mix ratio, this highly conductive system will save manufacturing costs with increased processing efficiency.

epoxySet is an innovative custom formulator of Epoxies, Urethanes, Silicones and Greases for the electronic, medical, semi-conductor, optics, automotive and aerospace industries. Our extensive experience allows us to quickly modify our extensive product line for any requirement. Please contact our technical support staff at 401-726-4500

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Published by EpoxySet on May 08, 2019

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