Master Bond Supreme 3HTND-2DM

Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.


 
 

For more information contact Master Bond

Request More Information
 

Master Bond

www.masterbond.com
E: main@masterbond.com
T: (201) 343-8983
F: (201) 343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
View map

Follow  
Facebook   Twitter   LinkedIn   YouTube   Pinterest
 
 
 
 
 
 

For more information send an inquiry directly to Master Bond






 

Master Bond

www.masterbond.com
E: main@masterbond.com
T: (201) 343-8983
F: (201) 343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
View map

Follow  
Facebook   Twitter   LinkedIn   YouTube   Pinterest
 
 

Close
CONTACT MASTER BOND
* sorry this is a required field