White Paper: Potting Compounds Protect Electronic Circuits

 

Potting and encapsulation compounds are designed to completely enclose a component, module or PCB, which effectively shields the unit while providing structural support. Learn about the performance properties of these systems, to uncover the best fit for the design and assembly of your electronic device.

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Master Bond

www.masterbond.com
E: main@masterbond.com
T: 201-343-8983
F: 201-343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
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Master Bond

www.masterbond.com
E: main@masterbond.com
T: 201-343-8983
F: 201-343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
View map

Follow  
Facebook   Twitter   LinkedIn   YouTube   Google+   Pinterest
 
 
 
 
 
 
 
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