One Component, High Strength Epoxy for Structural Bonding Applications

Epoxies in the Oil and Gas Industry
This whitepaper provides an overview of the oil and gas industry, from the extraction to its processing, and how epoxies play a vital role in the equipment and devices used in these pursuits. Properties exhibited by epoxy adhesives stand up to the hostile environments encountered in all aspects of the oil and gas industry--upstream, midstream and downstream.

Adhesives for Electronic Applications
Master Bond custom formulates epoxy adhesives, sealants, coatings, potting and encapsulation compounds to meet the rigorous needs of the electronic industry. We are a leading manufacturer of conformal coatings, glob tops, flip chip underfills, and die attach for printed circuit boards, semiconductors, microelectronics, and more. Browse our catalog to find out more.

Conductive Coatings Protect Circuitry from EM/RF and ESD
With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. In this paper, the different sources of interference are explored, as well as how coatings can play a critical role in protecting these sensitive components and boards.

Use of Epoxies as Protective Coatings against Corrosion for Metals
Explore the types and sources of corrosion of metal substrates. Corrosion may be prevented by protecting your design with the proper selection of epoxy based systems. Learn about the trade-offs of different curing agents used in epoxy coatings. Read more in this white paper.

Epoxies for Space Applications
Adhesives in space applications are subject to high vacuum and extreme temperatures, making adhesive choice a critical design consideration. Learn how low outgassing epoxies satisfy these stringent conditions ensuring reliable space applications.

Epoxies and Glass Transition Temperature
Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polymers, why glass transition temperature is significant, and how it is measured. Tg can be an extremely useful yardstick for determining the reliability of epoxies as it pertains to temperature.

High Temperature Resistant, NASA Low Outgassing Approved Epoxy for Die Attach Applications
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for bonding and sealing.

One Component Elastomeric Primer/Adhesive System Meets ISO 10993-5 Specifications
Master Bond X21Med is a one part system that can be used for bonding and priming polyolefinic surfaces. X21Med passes ISO 10993-5 tests for cytotoxicity making it suitable for medical device applications. 

Thermally Conductive, Electrically Insulative Epoxy Delivers Low Exotherm for Large Castings and Potting Applications
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system

Rapid Curing Two Component Epoxy Offers Impressive Chemical Resistance and High Bond Strength
Master Bond EP41S-F is a versatile, two part epoxy system for bonding, sealing, coating and encapsulating

Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions
This specialty non-halogenated system can be used for bonding, sealing and encapsulating applications in aircraft requiring stringent Airbus specifications be satisfied.

White Paper: Potting Compounds Protect Electronic Circuits

Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability
Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. 

MasterSil 705TC: Single Component Heat Dissipative Silicone Compound
One component, non-corrosive silicone for bonding, sealing & coating

Supreme 3HTND-2CCM Product Information
One component, toughened epoxy system for bonding, sealing, coating and encapsulating

EP21ARHT Product Information
Two component epoxy adhesive, sealant, coating and encapsulating system

EP38CL Product Information
Two component high performance epoxy for bonding, sealing, coating and encapsulation

EP42HT-2LTE Product Information
Two component, room temperature curing epoxy compound featuring an ultra low coefficient of thermal expansion

EP21SC-1 Product Information
Two component epoxy resin system for bonding, coating and sealing

Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity
Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm, making it well suited for potting and encapsulation applications. This high performance system can also be used for bonding and sealing....

Room Temperature Curing Epoxy Features Low Thermal Resistance
Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. 

Nanosilica Filled, Optically Clear Epoxy Features Superior Electrical Insulation Properties
Master Bond EP113 is a nanosilica filled epoxy that delivers enhanced dimensional stability and exceptionally low shrinkage upon curing. This optically clear, two component system is well suited for applications in the aerospace, electronic and OEM ind...

Flexible, One Component, Fast Curing Silicone for Medical Device Applications
Master Bond MasterSil 910Med is a one part acetoxy type silicone system that meets USP Class VI specifications for biocompatibility and ISO 10993-5 testing for cytotoxicity. This translucent paste also withstands many sterilization methods, including l...

Toughened, High Strength, Two Component Epoxy Offers Chemical, Abrasion and High Temperature Resistance
Master Bond Supreme 45HTQ-4 is a two component, toughened, silicon carbide filled epoxy for high performance bonding, sealing and casting. 

Non-Yellowing UV Curable System Has Superior Abrasion Resistance
Master Bond UV15X-6NM-2 is a one component, UV curing urethane acrylate system featuring vibrant flexibility, excellent toughness and superior abrasion resistance.

One Component Epoxy Adhesive Has Ultra Low Thermal Resistance and Meets NASA Low Outgassing Specifications
Master Bond Supreme 18TC is a single component epoxy adhesive that contains a blend of special thermally conductive fillers. This smooth paste system can be applied in bond lines as thin as 10-15 microns. 

Toughened, Room Temperature Curing Epoxy Offers A Long Working Life
Developed for high tech bonding and sealing applications, Master Bond Supreme 11HTLP is a two part epoxy that is often selected for the aerospace, electronics and specialty OEM industries. It combines user friendly processing with a high physical st...

Thermally Conductive, Electrically Insulative Two Part Silicone Meets NASA Low Outgassing Specifications
MasterSil 972TC-LO is capable of transferring heat while retaining superior dielectric properties. It bonds well to a wide variety of substrates, including metals, composites, glass, ceramics as well as many types of rubber and plastics. The system has...

One Component Dual Cure Epoxy Meets USP Class VI and ISO 10993-5 Specifications
Master Bond UV15DC80Med is a special dual cure epoxy based system that offers a primary cure using UV light along with a secondary heat curing mechanism. This extraordinary compound also meets USP Class VI specifications and passes ISO 10993-5 testing....

High Temperature Resistant, One Component Epoxy Cures at 200-220°F: EP17HT-100
Master Bond EP17HT-100 is a high performance, one part epoxy that combines easy handling with superb physical properties. 

High Temperature Resistant, One Part Fluorosilicone Offers Superior Chemical Resistance
Two component EP21AOLV-2Med, passes USP Class VI biocompatibility testing and ISO 10993-5 cytotoxicity requirements. It resists many chemicals including water, oils, fuels and most notably, EtO, radiation and many cold sterilants. This electrically iso...

One Component, Non-Drip Adhesive for Structural Bonding

No Mix, Thermally Conductive, Electrically Insulative Epoxy System Cures Rapidly At 80°C
One component epoxy system for bonding, sealing, potting and encapsulation applications featuring curing temperatures of 175-180°F or higher.

One Component, High Strength Epoxy for Structural Bonding Applications

One Component, High Strength Epoxy for Structural Bonding Applications
Serviceable up to +500°F, EP13SPND-2 is a one part epoxy paste for structural bonding applications. This electrically insulative system has a non-drip application feature that delivers high tensile, tensile lap shear and compressive strength of over 8,...

One Component, Neutral Curing Silicone Passes USP Class VI and ISO 10993-5 Tests

Toughened, One Component Epoxy Features High Bond Strength and Cryogenic Serviceability
Master Bond Supreme 10HTF-1 combines very fast curing and simple handling properties with a superior performance profile. It has a smooth paste consistency and is easy to apply.

Two Component Epoxy with Ultra Low Thermal Resistance and Superior Electrical Insulation Properties
Master Bond EP48TC is a breakthrough material pertaining to thermal management applications of epoxies. This system utilizes a unique combination of special high thermal conductive fillers and is capable of being applied in bond lines as thin as 10-15 ...

Low Stress, Optically Clear, One Part Silicone Meets NASA Low Outgassing Specifications
MasterSil 920-LO is a specialty type, high performance, RTV silicone for sealing, coating and small encapsulations.

Two Part, Room Temperature Curing Epoxy Features Ultra Low Coefficient of Thermal Expansion
Two component, room temperature curing epoxy compound features an ultra low coefficient of thermal expansion.

One Part Epoxy Resists up to 500°F and Meets NASA Low Outgassing Specifications

Electrically Insulative Epoxy Systems
Thermally Conductive, Two Component Epoxy Passes USP Class VI Tests and ISO 10993-5 Specifications

Low Viscosity, One Part Cyanoacrylate Is Non-Toxic and Meets ISO 10993-5 Specifications

One Component, Snap Cure Epoxy Features High Strength Properties

One Component, Electrically Conductive, Sodium Silicate, Aqueous Based Coating System
MB600G is a graphite conductive, water based, sodium silicate coating system that was developed for EMI/RFI shielding applications in the electronics and aerospace industries. This materials also features high thermal stability up to +700°F.

Low Viscosity, Two Component Epoxy is Optically Clear with Non-Yellowing Properties

Optically Clear, Condensation Curing Silicone Offers Superior Dielectric Properties

Two Component, Thermally Conductive Epoxy Resists High Temperatures

Optically Clear UV Curable System Offers High Bond Strength and Fast Cures

Thermally Stable, Two Part Epoxy Meets NASA Low Outgassing Specifications

Toughened Two Component Epoxy Is Optically Clear and Resists Thermal Cycling

Flexible Two Component Epoxy System Features Electrical and Thermal Conductivity

Chemical Resistant, High Strength Two Component Epoxy Withstands Elevated Temperatures
Master Bond EP62-1 withstands high temperatures up to 450°F and resists a variety of chemicals.

Thermally Conductive Two Component Silicone Meets UL 94V-0 Specification for Flame Retardancy

Optically Clear, Medical Grade Epoxy Features a High Glass Transition Temperature

New Silver Conductive, One Part Aqueous Based Sodium Silicate System Available for EMI/RFI Shielding

Two Component Room Temperature Curing Epoxy Meets UL 94V-0 Specifications for Flame Retardancy

High Temperature Resistant B-Staged Adhesive Film Features Thermal Conductivity and Electrical Insulation
Master Bond FLM36 is a B-staged film with a flexibilized epoxy chemistry that offers high temperature resistance, thermal conductivity, electrical insulation and the ability to withstand rigorous thermal cycling.

Dimensionally Stable UV Curable System with a High Glass Transition Temperature
Master Bond UV25 delivers the convenience of a one part, no mix system and rapid cures upon exposure to UV light. It features high temperature resistance and optical clarity with excellent light transmission properties.

Optically Clear, Two Component Urethane Modified Epoxy Gel Offers Dimensional Stability
Master Bond Super Gel 9’s low hardness imparts convenient handling as well as resistance to thermal cycling and mechanical shock.

One Component LED Curable System Offers Exceptionally Fast Cure Speeds
Cures Completely Tack-Free Without Requiring UV Light