Interconnect Systems Inc. Company Profile

Traditionally, electronics miniaturization has been achieved by semiconductor level integration, which combines several independent die in current-generation products into a single IC or ASIC for next-generation products. However, NRE for leading-edge ICs costs millions of dollars, making it cost prohibitive for many customers who need dense packaging for their applications. But now with the latest packaging technologies, you don't need cell phone production volumes to miniaturize and reduce costs on your next design.

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