ICE Box-PC building block system for extreme environments
Rugged computing is a must for lots of new IoT, M2M and Big Data applications deployed in extreme environmental conditions. Hardly any embedded computing hardware, however, is equipped to operate in - 60°C, let alone - 100 °C or to be immersed in water. To enable passively cooled standard hardwar...
Rugged computing is a must for lots of new IoT, M2M and Big Data applications deployed in extreme environmental conditions. Hardly any embedded computing hardware, however, is equipped to operate in - 60°C, let alone - 100 °C or to be immersed in water. To enable passively cooled standard hardware to nevertheless be operated in such extreme environments, ICOP Technology has developed the ICE Box, a new modular building block system with IP67 protection and active heating, which automatically activates if the temperature drops below a configurable minimum temperature (standard value is -20°C).
Owing to the modular build of the building block system, OEMs can order their individual ICE Box-PCs in numerous different configurations. Any required system configuration can be ordered from batch sizes of just one, including individual I/O covers and laser engraving of the housing and can be delivered within one week after specification approval. Applications can be found in outdoor, vehicle and marine deployment, as well as in refrigerated warehouses.
Amongst the standard components, which ICOP Technology offers for the ICE Box-PC building block system with passive cooling and active heating, are around 20 different standard CPU components with SFF, low power DM&P Vortex86 processor technology, power supplies as well as numerous I/O extensions for Ethernet and wireless (IoT) interfaces, USB, digital and analog I/O, fieldbuses as well as motion control applications. The interfaces can be mounted on the front or back panel according to requirements, paving the way for highly individual OEM configurations. The ICE Box-PC building block system is suited to OEMs requiring only small volumes (from batch sizes of one) to around 100 units. If at a later date larger field deployments are required, ICOP can also produce customized components and system housings. All the electronic and mechanical work is carried out ‘single source’ by ICOP.
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