Master Bond Supreme 3HTND-2DM

Developed for chip-on-board encapsulation applications, Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system that can be used for dam-and-fill. This video demonstrates the process of dispensing the epoxy paste and creating a barrier, or “dam”, which can then be filled by a flowable encapsulant. This thermally conductive compound also meets NASA low outgassing specifications and can withstand 1,000 hours at 85°C/85% RH.


 
 

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Master Bond

www.masterbond.com
E: main@masterbond.com
T: 201-343-8983
F: 201-343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
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For more information send an inquiry directly to Master Bond






 

Master Bond

www.masterbond.com
E: main@masterbond.com
T: 201-343-8983
F: 201-343-2132

Address
154 Hobart Street
Hackensack, NJ
07601
United States
View map

Follow  
Facebook   Twitter   LinkedIn   YouTube   Google+   Pinterest
 
 
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