BGA Socket Adapter Systems
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - el...
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices.
- Protects valuable PC boards by eliminating damage when devices need to be removed.
- Subjects device to lower thermal stress.
- Low insertion force design provides yields that are equivalent to direct attach, with coplanarity consistently better than the industry standard of .006/(0.152mm).Same footprint as BGA or LGA device.
- Over 2,000 footprints available from 1.27mm down to 0.50mm pitch.
- Multi-finger, high reliability contacts and screw-machined terminals for superior reliability.
- Value-added features such as solder balls and tape and reel packaging reduce processing and application costs.
- Available in 0.50mm, 0.65mm, 0.80mm, 1.0mm, and 1.27mm pitch.
- Choose from Lead-free or eutectic Tin/Lead solder ball terminals.
- Available in tape and reel packaging for automated assembly.
Application Note: Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production.This, along with other challenges associated with QFP packages such as non-coplanar leads “lifting”after reflow, opened the door for newer, high density packages, such as Ball Grid Array (BGA), that are ultimately more cost effective and process friendly. A robust alternative has been developed for using BGA devices on boards designed with QFP pads. This proprietary technology employs the advantages of the BGA package directly on the board interface –eliminating the design weaknesses and processing challenges associated with gull-wing leads, while allowing uninterrupted production using existing board inventory.
For more information send an inquiry directly to Advanced Interconnections Corporation
5 Energy Way
West Warwick, RI